High-productivity wire-cut EDM
Standard model pursuing a cost performance machining system

MITSUBISHI 

MV1200S

ML605GTW3-H

ML605GTF5-5500UM

MV2400S

laser processing machine for substrate drilling

ML605GTW5

ML605GTW5-H

MX600

GTW3

DWC 90

The Mitsubishi GTW4 is a laser drilling machine designed for high-precision drilling of small-diameter holes in various materials. It utilizes a CO₂ laser with a wavelength of 9.3 μm to achieve precise drilling, even in challenging materials like polymer-laminated glass. 

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ML605GTW3-H

MV1200S

ML605GTF5-5500UM

MV2400S

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