Base and precious metals plating
Copper flash plate, panel plate, pattern plate
Developing, etching, stripping
Chemical cleaning

Repeatable performance with high Cpk
Thickness uniformity to +/-5%
Current density to 10ASD
Homogeneous plating with no layer separation
Eliminates plating voids and pits resulting from trapped gases

TECHNIC

MP100

SEMCON 2000

The Semcon 1000 is easy to operate and has been used extensively for copper, nickel, and gold plating. Its universal design allows for use with any commercially available electroplating solution and it can be specially designed to meet class 1000 cleanroom specifications.

Applications:
-Advanced Packaging
-MEMS
-LED
-MicroLED
-Photonics


TECHNIC

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MP100

SEMCON 2000

SEMCON 1000

SEMCON 1500

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