Applied Materials is committed to accelerating this new PPACt playbook for our customers and partners. We have the broadest and deepest portfolio of products for delivering PPACt innovations to the market. This portfolio encompasses the ability to create and deposit, shape and remove, modify, analyze, and connect materials and devices in new ways. We are unique in having a broad suite of process technology and metrology capabilities under one roof, and we have highly differentiated silicon and packaging lab capabilities. Our Integrated Materials Solutions co-optimize materials deposition, removal, modification, and analysis to create new materials and engineer new structures for high-performance, low-power chips at leading-edge nodes.

APPLIED MATERIALS (AMAT)

PRODUCER EXT

Number of Chambers 3 (A, B, C, D): 3(A, B, C)
Load Locks LL1, LL2: LL1, LL2
Transfer Chamber: Vacuum Robot
Process Chambers eXT Metal Etch Chambers: eXT Metal Cu Etch
RF Generator: 13.56 MHz / Bias RF
Vacuum: Pump Turbo
ESC Type: Electrostatic Chuck
Temperature: Backside He Cooling
Endpoint Detection: Optical Emission Spectroscopy (if equipped)
Factory Interface: EFEM + FOUP Load Ports
Communications: SECS/GEM, GEM300
Utilities CDA, N₂, Process Gas, Cooling Water, Vacuum
Safety Systems: Gas Monitoring, Interlocks, EMO

Chamber Process
PM1: Metal Main Etch
PM2: Metal Main Etch
PM3: Metal Main Etch
Chillers: Nil
Monitor: 3 sets

Does not include: Dry pumps, Chillers, HDD.

AMAT Producer eXT Metal configuration.pdf

Producer eXT Metal 436533 configuration_Page_6_Image_0001.jpg

Producer eXT Metal 436533 configuration_Page_3_Image_0002.jpg

Producer eXT Metal 436533 configuration_Page_4_Image_0002.jpg

Producer eXT Metal 436533 configuration_Page_5_Image_0001.jpg

Producer eXT Metal 436533 configuration_Page_5_Image_0002.jpg

Producer eXT Metal 436533 configuration_Page_7_Image_0001.jpg

Producer eXT Metal 436533 configuration_Page_3_Image_0001.jpg

Producer eXT Metal 436533 configuration_Page_4_Image_0001.jpg

Producer eXT Metal 436533 configuration_Page_3_Image_0003.jpg

Producer eXT Metal 436533 configuration_Page_2_Image_0001.jpg

Number of Chambers 3 (A, B, C, D: 3(A, B, C)
Load Locks LL1, LL2: LL1, LL2
Transfer Chamber: Vacuum Robot
Process Chambers eXT Metal Etch Chambers: eXT Metal Cu Etch
RF Generator: 13.56 MHz / Bias RF
Vacuum: Pump Turbo
ESC Type: Electrostatic Chuck
Temperature: Control Backside He Cooling Endpoint Detection Optical Emission
Spectroscopy(if equipped)
Factory Interface: EFEM + FOUP Load Ports
Communications: SECS/GEM, GEM300
Utilities CDA, N₂, Process Gas, Cooling Water, Vacuum
Safety Systems: Gas Monitoring, Interlocks, EMO

Chamber Process
PM1: Metal Main Etch
PM2: Metal Main Etch
PM3: Metal Main Etch
Chillers: Nil
Monitor: 3 sets 

Does not include: Dry pumps, Chillers, HDD.

Producer eXT Metal 436004 configuration_Page_3_Image_0001.jpg

Producer eXT Metal 436004 configuration_Page_3_Image_0002.jpg

Producer eXT Metal 436004 configuration_Page_7_Image_0001.jpg

Producer eXT Metal 436004 configuration_Page_6_Image_0001.jpg

Producer eXT Metal 436004 configuration_Page_5_Image_0002.jpg

Producer eXT Metal 436004 configuration_Page_6_Image_0002.jpg

Producer eXT Metal 436004 configuration_Page_4_Image_0001.jpg

Producer eXT Metal 436004 configuration_Page_5_Image_0001.jpg

Producer eXT Metal 436004 configuration_Page_2_Image_0001.jpg

Number of Chambers 3 (A, B, C, D): 3(A, B, C)
Load Locks LL1, LL2: LL1, LL2
Transfer Chamber: Vacuum Robot
Process Chambers eXT Metal Etch Chambers: eXT Metal Cu Etch
RF Generator: 13.56 MHz / Bias RF
Vacuum: Pump Turbo
ESC Type: Electrostatic Chuck
Temperature: Backside He Cooling
Endpoint Detection: Optical Emission Spectroscopy (if equipped)
Factory Interface: EFEM + FOUP Load Ports
Communications: SECS/GEM, GEM300
Utilities CDA, N₂, Process Gas, Cooling Water, Vacuum
Safety Systems: Gas Monitoring, Interlocks, EMO

Chamber Process
PM1: Metal Main Etch
PM2: Metal Main Etch
PM3: Metal Main Etch
Chillers: Nil

Does not include: Dry pumps, Chillers, HDD.

AMAT Producer eXT Metal Configuration.pdf

Producer eXT Cu Etch 432424_Page_3_Image_0001.jpg

Producer eXT Cu Etch 432424_Page_4_Image_0002.jpg

Producer eXT Cu Etch 432424_Page_3_Image_0002.jpg

Producer eXT Cu Etch 432424_Page_4_Image_0001.jpg

Producer eXT Cu Etch 432424_Page_5_Image_0001.jpg

Producer eXT Cu Etch 432424_Page_5_Image_0002.jpg

Producer eXT Cu Etch 432424_Page_3_Image_0003.jpg

642c43e3029c4371972b5bcceddf03d0_producerextcuetch432424page2image0001_f.jpg

Producer eXT Poly Etch 411038Configuration_Page_2_Image_0001.jpg

Producer eXT Poly Etch 411038Configuration_Page_3_Image_0001.jpg

Producer eXT Poly Etch 411038Configuration_Page_3_Image_0003.jpg

Producer eXT Poly Etch 411038Configuration_Page_3_Image_0002.jpg

Producer eXT Poly Etch 411038Configuration_Page_4_Image_0001.jpg

Producer eXT Poly Etch 411038Configuration_Page_4_Image_0002.jpg

Producer eXT Poly Etch 411038Configuration_Page_4_Image_0003.jpg

Producer eXT Poly Etch 411038Configuration_Page_4_Image_0004.jpg

Number of Chambers 3 (A, B, C, D): 3(A, B, C)
Load Locks LL1, LL2: LL1, LL2
Transfer Chamber: Vacuum Robot
Process Chambers eXT Metal Etch Chambers: eXT Poly Etch
RF Generator: 13.56 MHz / Bias RF
Vacuum: Pump Turbo
ESC Type: Electrostatic Chuck
Temperature: Backside He Cooling
Endpoint Detection: Optical Emission Spectroscopy (if equipped)
Factory Interface: EFEM + FOUP Load Ports
Communications: SECS/GEM, GEM300
Utilities CDA, N₂, Process Gas, Cooling Water, Vacuum
Safety Systems: Gas Monitoring, Interlocks, EMO

Chamber Process
PM1: Metal Main Etch
PM2: Metal Main Etch
PM3: Metal Main Etch
Chillers: 3 pcs

Does not include: Dry pumps.

PRODUCER EXT

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