DISCO develops, manufactures, and sells precision machines and precision processing tools.

DISCO

DFD650

DISCO DFD650 Fully Automatic Dicing Saw

Manufacturer: DISCO
Model: DFD650
MFG No.: EP131
Manufacturing Date: October 1996
Spindle Configuration: Dual Spindle
Maximum Spindle Speed: 60,000 rpm
Power Supply: AC 200V, 3-phase
Power Capacity: 4 kVA
Air Pressure: 0.5 MPa
Air Consumption: 350 NL/min
N2 Pressure: 0.5 MPa
N2 Consumption: 200 NL/min
Cutting Water Pressure: 0.3 MPa
Cutting Water Flow: 14 L/min
Cooling Water Pressure: 0.2 MPa
Cooling Water Flow: 3 L/min
Machine Weight: 1,300 kg

Fully automatic dicing saw for semiconductor wafer processing. Equipped with dual spindles and automatic wafer handling.

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DFD650

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