Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.Documents
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Verified
CATEGORY
Defect Inspection
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
128833
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / RUDOLPH / AUGUST
F30
CATEGORY
Defect Inspection
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
128833
Wafer Sizes:
Unknown
Vintage:
2011
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The F30™ System is an advanced inspection tool designed to blur the lines between dark field micro inspection and traditional macro inspection. It provides automated defect inspection for front-end and outgoing quality (OQA) applications. The system boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite, the F30 System redefines inspection cost of ownership expectations. It has a throughput of up to 120 wph (10µm) and resolution flexibility (10µm to 0.5µm). It also has three simultaneous color defect review methods: on-the-fly, high resolution, whole wafer. The F30 System is suitable for a variety of applications including After develop inspection (ADI), Fab Outgoing QA, Post CMP inspection, and After etch inspection. It can also team with edge and backside modules for an all-surface solution.Documents
No documents