Description
High-precision multi-chip pasting process for semiconductor integrated circuits, MEMS sensors, microwave radio frequency devices and other product packaging. Equipment name: Flexible Multi-Chip Die BonderConfiguration
Configuration attached belowOEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.Documents
PREFERRED
SELLER
Verified
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
126809
Wafer Sizes:
Unknown
Vintage:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PREFERRED
SELLER
BESI / DATACON
2200 EVO
CATEGORY
Die Bonders / Sorters / Attachers
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
126809
Wafer Sizes:
Unknown
Vintage:
2023
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
High-precision multi-chip pasting process for semiconductor integrated circuits, MEMS sensors, microwave radio frequency devices and other product packaging. Equipment name: Flexible Multi-Chip Die BonderConfiguration
Configuration attached belowOEM Model Description
The Datacon 2200 evo is a high-accuracy multi-chip die bonder designed to offer exceptional flexibility for die attach and flip chip applications in the semiconductor industry. It comes equipped with advanced features such as an integrated dispenser, 12-inch wafer handling capability, automatic tool changer, and application-specific tooling. The machine is well-prepared to handle a wide range of present and future processes and products, making it a versatile and reliable choice for semiconductor manufacturing.Documents
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