Description
Description Dimension Qty Main Frame 89X97X86 1 Rorze Factory Interface 71X35X87 1 System Controller 43X42X85 1 Generator Rack 24X43X83 1 Neslab HX-150 #1 22X37X39 1 Neslab HX-150 #2 22X37X39 1 AMAT HX 21X28X29 1 Monitor/Endpoint rack 25X27X55 1 Gas Panel Upper Exhaust Duct 64X8X12 1 Tote #1, (Large Pallet Tote) 41X49X37 1 DTCU Lift, Main / Right 76X10X5 1 DTCU Lift, Main / Left 76X10X5 1 DTCU Lift, Transport 121X4X10 1 DTCU Lift, Hoist / Left 78X5X10 1 DTCU Lift, Hoist / Right 78X5X10 1Configuration
CHAMBER POSITION: CH #A - DPS ETCH CHAMBER CH #B - DPS ETCH CHAMBER CH #C - EMPTY CH #D - DPS ETCH CHAMBER CH #E - EMPTY CH #F - ORIENTER CHAMBER Buffer ROBOT : HP FACTORY INTERFACE RORZE CHILLER #1 : AMAT HX CHILLER #2 : NESLAB HX-150 CHILLER #3 : NESLAB HX-150 CH #A CONFIG - TURBO : LEYBOLD - C/M : - RF MATCHING UNIT : - RF GENERATOR : - MFC #1 : CL2 300 SCCM AERA - MFC #2 : HBr 300 SCCM STEC - MFC #3 : SF6 100 SCCM AERA - MFC #6 : CF4 200 SCCM STEC - MFC #7 : Ar 300 SCCM STEC - MFC #8 : O2 300 SCCM STEC 4400N GOLD - MFC #9 : O2 100 SCCM STEC - MFC #10 : N2 100 SCCM AERA CH #B CONFIG - TURBO : LEYBOLD - C/M : - BIAS RF MATCHING UNIT : - TOP RF MATCHING UNIT : - BIAS RF GENERATOR : - BIAS RF GENERATOR : - MFC #1 : CL2 100 SCCM STEC - MFC #2 : HBr 300 SCCM STEC - MFC #3 : SF6 20 SCCM AERA - MFC #6 : CF4 200 SCCM STEC - MFC #7 : Ar 300 SCCM STEC - MFC #8 : O2 50 SCCM STEC - MFC #9 : HeO2 5 SCCM AERA - MFC #10 : N2 100 SCCM AERA CH #D CONFIG - TURBO : LEYBOLD - C/M : - BIAS RF MATCHING UNIT : - TOP RF MATCHING UNIT : - BIAS RF GENERATOR : - BIAS RF GENERATOR : - MFC #1 : CL2 100 SCCM STEC - MFC #2 : HBr 200 SCCM STEC - MFC #6 : CF4 200 SCCM STEC - MFC #7 : Ar 300 SCCM STEC - MFC #8 : O2 50 SCCM STEC - MFC #9 : O2 5 SCCM AERA - MFC #10 : N2 100 SCCM AERA CH #E CONFIG EMPTY CH#F CONFIG ORIENTER L/L CONFIG - WIDE BODY BUFFER CONFIG - HP ROBOTOEM Model Description
Two new etch systems were launched in 1996 for HDP etching of metal and silicon films, using AMAT's DPS (Decoupled Plasma Source) technology. The DPS Metal Etch Centura and DPS Silicon Etch Centura are aimed at very advanced applications, primarily for deep submicron devices (0.25-micron).Documents
CATEGORY
Dry / Plasma Etch
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127793
Wafer Sizes:
8"/200mm
Vintage:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA METAL DPS
CATEGORY
Dry / Plasma Etch
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127793
Wafer Sizes:
8"/200mm
Vintage:
1997
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available