Description

The Surface Technology Systems Multiplex range of plasma systems combine a single wafer or batch vacuum load lock with STS etch plasma source to produce a platform of unrivaled quality and reliability for both R&D and pilot-production applications. SYSTEM DESCRIPTION: Surface Technology Systems Multiplex Reactive Ion Etcher (RIE) designed for etching of 3-8 inch GaAs wafers. System can be configured with Multiplex Atmospheric Cassette System (MACS wafer handling module shown in photo; upgrade option; subject to availability). System includes: load lock, PC-controlled RIE process chamber, power distribution cabinet, RF rack, remote gas box, and chiller. SPECIAL NOTE: Photos show the system configured with the OPTIONAL Multiplex Atmospheric Cassette System (MACS) attached. The MACS module allows for automated wafer loading (2 cassettes); it can be run in automatic mode (cassette-to-cassette) or manual mode (manual wafer load). MACS MODULE SOLD SEPARATELY.

Configuration

STS Multiplex RIE System Configuration: MACS Wafer Loader: Multiplex Atmospheric Cassette System for automated wafer loading (2 cassettes); can run in automatic mode (cassette-to-cassette) or manual mode (manual wafer load); upgrade option; subject to availability at time of order Load Lock System: Wafer size from 3 inch to 8 inch (75mm to 200mm) capable; Wafer set size = 6 inch (150mm); requires Leybold Ecodry L rotary pump or equivalent (not included). RIE Process Module: MESC RIE SC100M process chamber; version 1.0; PC controlled; Intellimetrics end-point detector (EPD) sn300.110+sn300.002+sn300.001+frame grabber; Electrode temperature control (+5 to +40 deg C); non-clamped electrode; ENI ACG3B 300/30 watt (13.56MHz) RF supply & matching unit; Remote gasbox; requires Leybold Dryvac 50S dry pump or equivalent (not included) Electrode Cooling: Bettatech CU500 chiller (DI water +5 to +40 deg C) Gasbox: Remote R/H (standard - inc 2x PFC1 module); (1) O2=100sccm; (2) Ar=100sccm; (3) CF4=200sccm; (4) CHF3=200sccm.