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TEL / TOKYO ELECTRON TELIUS SP 305 SCCM
  • TEL / TOKYO ELECTRON TELIUS SP 305 SCCM
  • TEL / TOKYO ELECTRON TELIUS SP 305 SCCM
  • TEL / TOKYO ELECTRON TELIUS SP 305 SCCM
Description
Dielectric Etch
Configuration
No Configuration
OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
Documents

No documents

CATEGORY
Dry / Plasma Etch

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

62500


Wafer Sizes:

12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON

TELIUS SP 305 SCCM

verified-listing-icon
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
listing-photo-0a8fefa5d54349928dda328508610b06-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

62500


Wafer Sizes:

12"/300mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dielectric Etch
Configuration
No Configuration
OEM Model Description
Telius-SP is a high-performance etching system designed for large diameter (300 mm) requirements. It is part of the Telius platform and offers improved productivity through increased throughput, a reduced footprint, and higher energy efficiency. The system can be fitted with various chamber applications, including DRM and SCCM chambers, to support a wide range of process areas. It can support up to 4 chambers and boasts a high throughput, compact design, and low cost of ownership (CoO). Additionally, the system is designed for ease of maintenance. Overall, Telius-SP is a versatile and cost-effective solution for large diameter etching needs.
Documents

No documents

Similar Listings
View All