We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
Dry EtcherConfiguration
No ConfigurationOEM Model Description
The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
35058
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
UNITY II-855II
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
35058
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Dry EtcherConfiguration
No ConfigurationOEM Model Description
The Unity II is an etch system developed by TEL, which is part of their 200mm UNITY® series. The series is known for its reliability and has been improved upon with the development of the UNITY® II, the UNITY® IIe, and most recently the UNITY® M(e). The system provides a reliable platform for various chambers and utilizes two plasma sources: DRM (Dipole Ring Magnet), which is a MERIE source, and SCCM (Super Capacitively Coupled Module), which applies to dual high-frequency plasma sources. The DRM has been successful in Dielectric and Silicon Deep Trench etch applications, while the SCCM provides controlled plasma dissociation and independent control of plasma bias. The UNITY® series achieves excellent process performance for the 130 nm design rule and later generations, while also offering optimal productivity and reliability. It is based on ongoing refinements to a proven platform.Documents
No documents