
Description
The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. Fully operational and still installed.Configuration
442 nm wavelength, 300 mW, HeCd laser (replaced in 2014, has around 4400 hours of usage) 4 mm write head 20 mm write head Flowbox Greyscale exposure Upgraded computer to Windows 7 in 2019 Metrology and Alignment PackageOEM Model Description
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.Documents
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Verified
CATEGORY
Lithography
Last Verified: 7 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
115928
Wafer Sizes:
Unknown
Laser:
442
Vintage:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DWL 66
CATEGORY
Lithography
Last Verified: 7 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
115928
Wafer Sizes:
Unknown
Laser:
442
Vintage:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. Fully operational and still installed.Configuration
442 nm wavelength, 300 mW, HeCd laser (replaced in 2014, has around 4400 hours of usage) 4 mm write head 20 mm write head Flowbox Greyscale exposure Upgraded computer to Windows 7 in 2019 Metrology and Alignment PackageOEM Model Description
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.Documents
No documents