
Description
No descriptionConfiguration
Condition: Power ON Docking Type(Not Including Docking Interface): ST6731A OS: S7.39FC Hinge: MHF4000S Auto CardChange: Yes -Stage unit Chuck: Nickel Chuck Temp: Ambient/Hot Chuck Chuck Temp: 30℃~150℃ Cleaning unit: Yes -Others Tester I/F: GPIB OCR: Yes Inker: No Ethernet: YesOEM Model Description
The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.Documents
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PREFERRED
SELLER
Verified
CATEGORY
Probers
Last Verified: Over 30 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125413
Wafer Sizes:
Unknown
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllPREFERRED
SELLER
ACCRETECH / TSK
UF2000
CATEGORY
Probers
Last Verified: Over 30 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125413
Wafer Sizes:
Unknown
Vintage:
2011
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Condition: Power ON Docking Type(Not Including Docking Interface): ST6731A OS: S7.39FC Hinge: MHF4000S Auto CardChange: Yes -Stage unit Chuck: Nickel Chuck Temp: Ambient/Hot Chuck Chuck Temp: 30℃~150℃ Cleaning unit: Yes -Others Tester I/F: GPIB OCR: Yes Inker: No Ethernet: YesOEM Model Description
The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.Documents
No documents