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ONTO / NANOMETRICS / ACCENT / BIO-RAD NANOSPEC 6100
  • ONTO / NANOMETRICS / ACCENT / BIO-RAD NANOSPEC 6100
Description
No description
Configuration
No Configuration
OEM Model Description
The NanoSpec 6100 is a tabletop film analysis system that provides fast and low-cost measurement capabilities for thin film metrology. It uses non-contact spectroscopic reflectometry to measure sites as small as 10µm in diameter on production wafers and can measure wafer substrates in the size range of 75 to 200mm and photomasks from 5 to 9 inches square. The system can measure film thickness in the range of 200Å - 20µm with the visible light source and 25Å - 20µm with an optional UV light source. The upper thickness range can be extended to 70µm with the thick film option. The system also has a motorized, precision x-y sample stage with a resolution of better than 1µm and a high-resolution color graphics display that provides contour and 3D film thickness mapping.
Documents

No documents

CATEGORY
Thin Film / Film Thickness

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

115126


Wafer Sizes:

8"/200mm


Vintage:

Unknown


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

ONTO / NANOMETRICS / ACCENT / BIO-RAD

NANOSPEC 6100

verified-listing-icon
Verified
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
listing-photo-0061da4d60054fec97f7920817e94d75-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1987/0061da4d60054fec97f7920817e94d75/c1bbf1298b8a44dcb30641e0163f9183_spk39100_mw.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

115126


Wafer Sizes:

8"/200mm


Vintage:

Unknown


Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The NanoSpec 6100 is a tabletop film analysis system that provides fast and low-cost measurement capabilities for thin film metrology. It uses non-contact spectroscopic reflectometry to measure sites as small as 10µm in diameter on production wafers and can measure wafer substrates in the size range of 75 to 200mm and photomasks from 5 to 9 inches square. The system can measure film thickness in the range of 200Å - 20µm with the visible light source and 25Å - 20µm with an optional UV light source. The upper thickness range can be extended to 70µm with the thick film option. The system also has a motorized, precision x-y sample stage with a resolution of better than 1µm and a high-resolution color graphics display that provides contour and 3D film thickness mapping.
Documents

No documents