Description
WIRE BOND Manufactured : 31-08-10Configuration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118078
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
118078
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
WIRE BOND Manufactured : 31-08-10Configuration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME is an advanced semiconductor die bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME is designed to provide high-precision die bonding capabilities for semiconductor manufacturing processes.Documents
No documents