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Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.Documents
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
61688
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
8090
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
61688
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Model 8090, a large area wedge bonder designed to process the large panels and carriers used in chip-on-board (COB), multi-chip modules (MCMs) and similar devices.Documents
No documents