Description

No description

Configuration

No Configuration

OEM Model Description

The ps(Power Series) IConnPS ball bonder, which replaced the Maxum Ultra ball bonder and improves IC inter-connect performance with expanded technology that addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

Documents

No documents

KULICKE & SOFFA (K&S)

IConn

Verified

Wire / Wedge / Ball Bonder

Last Verified: 21 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

128684

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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