
Description
X-ray diffractometerConfiguration
Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Factory interface: (Qty 2) FOUP Options system: Primary optics for micro diffraction, TSX X-ray system LynxEye detector for secondary side with mount Keyence laser triangulation module for fast height alignment Pattern recognition software Wafer chuck Handler system: Standard automation and softwareOEM Model Description
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.Documents
No documents
Verified
CATEGORY
X-Ray / XRD / XRF
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152882
Wafer Sizes:
12"/300mm
Vintage:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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D8 FABLINE
CATEGORY
X-Ray / XRD / XRF
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152882
Wafer Sizes:
12"/300mm
Vintage:
2015
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
X-ray diffractometerConfiguration
Software Version: 77-2.3A-6A-5A-5A-RR6A CIM: E84, SECS/GEM, GEM300 Factory interface: (Qty 2) FOUP Options system: Primary optics for micro diffraction, TSX X-ray system LynxEye detector for secondary side with mount Keyence laser triangulation module for fast height alignment Pattern recognition software Wafer chuck Handler system: Standard automation and softwareOEM Model Description
The D8 FABLINE provides fully automated handling of 300mm wafers . It provides a wide spectrum of techniques, such as rapid X-ray reflectivity (XRR), grazing incidence X-ray diffraction (GID), and high-resolution X-ray diffraction (HR-XRD) in order to facilitate advanced process development and control on strained devices and high-K thin films, as well as materials characterization for future generation technology nodes.Documents
No documents