Description
No descriptionConfiguration
AMAT P5000 PECVD -Films required SiO2 and SiNx -Stress controlled, tensile to compressive -SiH4 based chemistries -RF Clean system for chamber clean -Mainframe 150mm, SNNF wafers, through the wall fit -Storage Elevator. Robot, cassette handling -Dual Frequency RF for Stress Control -RF Clean system and chemistry Chambers A - xL PE Delta Nitride OEM setup for standard films B - xL PE Delta Nitride OEM setup for standard films -New process kits -fully rebuilt and tested gas box with MFC's -fully calibrated RF and PSU components all system interconnect and Heat exchangers AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangersOEM Model Description
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.Documents
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CATEGORY
CVD
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103697
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
P5000 CVD
CATEGORY
CVD
Last Verified: 24 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103697
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
AMAT P5000 PECVD -Films required SiO2 and SiNx -Stress controlled, tensile to compressive -SiH4 based chemistries -RF Clean system for chamber clean -Mainframe 150mm, SNNF wafers, through the wall fit -Storage Elevator. Robot, cassette handling -Dual Frequency RF for Stress Control -RF Clean system and chemistry Chambers A - xL PE Delta Nitride OEM setup for standard films B - xL PE Delta Nitride OEM setup for standard films -New process kits -fully rebuilt and tested gas box with MFC's -fully calibrated RF and PSU components all system interconnect and Heat exchangers AMAT P5000 RIE Technology -RIE of SiO2, SiNx and Si -2 chambers with full gas panel -Computerized endpoint system -ESC wafer handling for minimum edge exclusion -Remanufactured P5000 system for RIE of Oxides and Nitrides -Mainframe 150mm, SNNF wafers, through the wall fit -15 slot storage elevator, Phase IV Robot -Polyimide ESC for etch uniformity and low particles -Endpoint Computer with monochromators -Gas panel custom built, with process & chemistries Chambers A- MxP Oxide, Oxide/Nitride Etch gas panel B- MxP Oxide, Oxide/Nitride Etch gas panel -new process kits -fully rebuilt and tested gas box with MFC's fully calibrated RF and PSU components -all system interconnect, and heat exchangersOEM Model Description
The Applied Materials Precision 5000 CVD is a single system solution for depositing high-quality, low-temperature dielectric materials on semiconductor devices. It incorporates multi-step processes to provide enabling technology for void-free intermetal dielectric deposition with profile control. The system’s process flexibility over a wide range of applications reduces the number and types of machines required for CVD. This makes it an efficient and cost-effective solution for semiconductor manufacturing.Documents
No documents