Description

P-5000 Mark II MxP Poly

Configuration

Polysilicon Etch Etch/Ash/Clean - Plasma Processing Currently Configured for: 200mm Software: 4.8_26 MF: P5000 Mark II Qty 4 - MxP Poly ESC: Polymide Gases Used: SF6, HE, CHF3, AR, N2, CF4, O2, HBR, CL2, HE/O2 MFCs: 26 DIgital MFC's Unit or Horiba Robot: ROBOT ASSY 8 IN AMAT 5000 Dry Pumps: 1-BA100, 2 DS80/250, 2-IQDP80/WSU151 Chillers: 3-Neslab 150, 1-AMAT-0

OEM Model Description

The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.

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APPLIED MATERIALS (AMAT)

P5000 ETCH

Verified

Dry / Plasma Etch

Last Verified: 26 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

125400

Wafer Sizes:

6"/150mm, 8"/200mm

Vintage:

Unknown

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