Description

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Configuration

2 MxP + Chambers

OEM Model Description

The AMAT P5000 Etch is a magnetically enhanced reactive ion etching system (MERIE) with two functional process chambers (Chambers B & C). P5000 Chamber B is primarily used for etching silicon based dielectrics (silicon dioxide, silcon nitride, etc.) and some carbon based compounds (resist, poly imide, etc) while chamber C is mainly used for silicon etching with high selectivity to underlying dielectric such as silicon dioxide. The system can process only 4" wafers. Pieces have to be attached to a 4" wafer. Though the process chamber processes one wafer at a time, up to 25 wafers can be loaded per batch.

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APPLIED MATERIALS (AMAT)

P5000 ETCH

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Dry / Plasma Etch

Last Verified: Over 60 days ago

Buyer pays 12% premium of final sale price

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

114275

Wafer Sizes:

6"/150mm

Vintage:

1995

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